Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-10-31
1998-01-13
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 364715, 364719, 364720, H05K 720
Patent
active
057085668
ABSTRACT:
An electronic control module (10) includes a circuit substrate (12) containing a plurality of thermal vias (36) and a heat-generating electronic device (26) attached to the thermal vias (36). The circuit substrate (12) is attached to a mounting plate (18) by a plurality of electrically-isolated, thermal attachment pads (20) located at selected positions on an electrically insulating layer (16) overlying a metal baseplate (14). A solder layer (22) functions to both mechanically attach the plurality of thermal vias (36) to the plurality of thermal attachment pads (20), and to provide a thermal dissipation pathway for heat generated by the electronic devices (26). The heat is transferred from the circuit substrate (12) through the plurality of thermal attachment pads (20) to the metal baseplate (14).
REFERENCES:
patent: 5262922 (1993-11-01), Yamaii et al.
patent: 5352926 (1994-10-01), Andrews
patent: 5353192 (1994-10-01), Nordin
patent: 5410449 (1995-04-01), Brunner
patent: 5467251 (1995-11-01), Katchmar
patent: 5646826 (1997-07-01), Katchmar
Anderson David J.
Andrews Kevin M.
Christopher Gary L.
Hunninghaus Roy E.
Tomase Joseph P.
Dockrey Jasper W.
Motorola Inc.
Thompson Gregory D.
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