Solder-bearing wafer for use in soldering operations

Details Solder-bearing wafer for use in soldering operations Solder-bearing wafer for use in soldering operations

2005-05-31

2005-05-31

Cuneo, Kamand (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S262000, C174S263000, C228S056300, C438S800000, C029S832000

Reexamination Certificate

active

06900393

ABSTRACT:
A solder bearing—bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and second surface, opposing the first surface. The first surface has grooves (115, 117) formed therein and includes length of solder (130) dispersed within groove. Upon heating the solder and placement of the wafer between the first and second devices, the two devices are connected.

REFERENCES:
patent: 4684055 (1987-08-01), Baer et al.
patent: 4807799 (1989-02-01), Myong et al.
patent: 5210940 (1993-05-01), Kawakami et al.
patent: 5216807 (1993-06-01), Yoshizawa et al.
patent: 5986338 (1999-11-01), Nakajima
patent: 6080936 (2000-06-01), Yamasaki et al.
patent: 6112001 (2000-08-01), Kishida et al.
patent: 6119920 (2000-09-01), Guthrie et al.

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