Solder-bearing lead having solder flow-control stop means

Details Solder-bearing lead having solder flow-control stop means Solder-bearing lead having solder flow-control stop means

1981-02-04

1982-08-24

McGlynn, Joseph H.

Geometrical instruments

H01R 906

Patent

active

043458149

ABSTRACT:
A solder-bearing lead (10) is provided with solder flow-control stops (20 and 22) on opposite surfaces of a contact finger (18) closely adjacent a flux-bearing solder preform (12) on the contact finger, to preclude flow of molten solder from the solder preform along the contact finger to a stem (26) of the lead in a soldering operation. The first solder flow-control stop (20) forces the molten solder to flow directly across sides of the contact finger (18) to a contact pad (14), where it is confined by the second solder flow-control stop (22) to form a soldered connection (24) in a reduced time period and without the necessity for any significant supplemental fluxing. Additional solder flow-control stops (38 and 40) also are formed on resilient spring clamping fingers (28) of the lead. The solder flow-control stops (20, 22, 38 and 40) are formed by oxidized portions of a phosphor bronze base metal from which portions of solder-wettable tin coatings (42 and 44) have been removed.

REFERENCES:
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patent: 3351704 (1967-11-01), Sitzler
patent: 3750252 (1973-08-01), Landman
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patent: 3864004 (1975-02-01), Friend
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patent: 4034471 (1977-07-01), Bias
patent: 4085998 (1978-04-01), Owens
patent: 4120558 (1978-10-01), Seidler
patent: 4203648 (1980-05-01), Seidler

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