Solder bearing lead and method of fabrication

Details Solder bearing lead and method of fabrication Solder bearing lead and method of fabrication

1994-09-29

1997-02-11

Nguyen, Khiem

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

439 83, H01R 402

Patent

active

056014597

ABSTRACT:
A solder-bearing lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts and a tip, preferably in a V-shape, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly substantially no farther than said tip.

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patent: 5030144 (1991-07-01), Seidler
patent: 5334059 (1994-08-01), Seidler
patent: 5344343 (1994-09-01), Seidler

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