Solder-bearing lead

Geometrical instruments

Patent

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Details

339258R, 339275B, H05K 100, H01R 1122, H01R 402

Patent

active

045001499

ABSTRACT:
A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (22) of the preform directly engages a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (26) having an outer end portion (28) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded therein.

REFERENCES:
patent: 3351704 (1967-11-01), Sitzler
patent: 3750252 (1973-08-01), Landman
patent: 4019803 (1977-04-01), Schell
patent: 4120558 (1978-10-01), Seidler
patent: 4203648 (1980-05-01), Seidler
patent: 4302067 (1981-11-01), Monson et al.
patent: 4345814 (1982-08-01), Gutbier et al.
patent: 4357069 (1982-11-01), Milora
patent: 4433892 (1984-02-01), Seidler

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