Solder-bearing lead

Details Solder-bearing lead Solder-bearing lead

1992-08-17

1994-08-02

Pirlot, David L.

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

439885, H01R 402

Patent

active

053340590

ABSTRACT:
A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.

REFERENCES:
patent: 1835251 (1931-12-01), Wetstein
patent: 1899360 (1933-02-01), Roudebulch et al.
patent: 4120558 (1978-10-01), Seidler
patent: 4634203 (1987-01-01), Noyes
patent: 4697865 (1987-10-01), Seidler
patent: 4737115 (1988-04-01), Seidler
patent: 4883435 (1989-11-01), Seidler
patent: 4961711 (1990-10-01), Fujuira et al.
patent: 5139448 (1992-08-01), Seidler
patent: 5154629 (1992-10-01), Carver et al.
patent: 5197901 (1993-03-01), Hashiguchi

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