Solder-bearing land

Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...

Patent

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Details

29843, H01R 402

Patent

active

054414296

ABSTRACT:
A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on one or both of the opposed faces of said solder-bearing portion. A region of the middle portion is twisted or the projections are bent so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate. The lead is arranged to provide, during soldering, direct metal-to-metal contact with the conductive area to which it is to be soldered, to avoid shifting of the parts due to molten solder.

REFERENCES:
patent: 4357069 (1992-11-01), Milora
patent: 4367910 (1983-01-01), Seidler
patent: 4605278 (1986-08-01), Seidler
patent: 4679889 (1987-07-01), Seidler
patent: 4900279 (1990-02-01), Dennis
patent: 5015206 (1991-05-01), Dennis
patent: 5030144 (1991-07-01), Seidler
"Clad Metals", Semi Alloys Corp., Tech Bull CM-64, Jul. 1968.

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