Solder bath apparatus

Details Solder bath apparatus Solder bath apparatus

1979-12-18

1982-02-16

Rosenbaum, Mark

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

118429, B23K 306

Patent

active

043155901

ABSTRACT:
A solder bath apparatus includes an outer open-ended vessel for containing molten solder and an inner open-ended vessel provided inside the outer vessel and adapted for forming thereon an overflowing layer of molten solder. A conduit member is connected at one end thereof to the bottom portion of the inner vessel and opens at the other end into the outer vessel. A feeding member, preferably, a rotating propeller, is provided in the conduit member for continuously feeding molten solder from the outer vessel to the inner vessel. A plate member is located in the upper portion of the inner vessel and has an opening along one side of the inner vessel to let the molten solder coming from the conduit to the inner vessel flow out only through the opening so that the overflowing layer is formed on the plate member and runs mainly in the direction away from the one side wall and toward the opposite side wall thereof.

REFERENCES:
patent: 3037274 (1962-06-01), Hancock
patent: 3589590 (1971-06-01), Fitzsimmons
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3726465 (1973-04-01), Boynton et al.

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