Solder balltape and method for making electrical connection betw

Dynamic magnetic information storage or retrieval – Record transport with head stationary during transducing – Drum record

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Details

29878, 437183, G11B 548, H01R 4302, H01L 2144

Patent

active

060468823

ABSTRACT:
A solder balltape comprised of an elongated tail with a ball of solder formed at one end. A plurality of the balltape structures are positioned on a carrier strip of solder. The balltape is positioned in contact with a transducer pad on a magnetic read/write slider and an electrical lead pad. A pulse of focused laser radiation is directed at the ball part of the balltape and a right angle fillet joint is formed. A subsequent laser pulse or a sharpened blade is used to remove the tail from the newly formed fillet joint.

REFERENCES:
patent: 3719981 (1973-03-01), Steitz
patent: 4154877 (1979-05-01), Vratny
patent: 4268849 (1981-05-01), Gray et al.
patent: 4761699 (1988-08-01), Ainslie et al.
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 5006917 (1991-04-01), Kang et al.
patent: 5120418 (1992-06-01), Kang et al.
patent: 5135155 (1992-08-01), Kang et al.
patent: 5148261 (1992-09-01), Kang et al.
patent: 5193738 (1993-03-01), Hayes
patent: 5219117 (1993-06-01), Lin
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5316205 (1994-05-01), Melton
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5337219 (1994-08-01), Carr et al.
patent: 5409157 (1995-04-01), Nagesh et al.
patent: 5471368 (1995-11-01), Downie et al.
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 5504277 (1996-04-01), Danner
patent: 5506385 (1996-04-01), Murakami et al.
patent: 5530604 (1996-06-01), Pattanaik
patent: 5559054 (1996-09-01), Adamjee
patent: 5586715 (1996-12-01), Schwiebert et al.
patent: 5604831 (1997-02-01), Dittman et al.
patent: 5646068 (1997-07-01), Wilson et al.
patent: 5828031 (1998-10-01), Pattanaik

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