Solder-ball supplying apparatus

Details Solder-ball supplying apparatus Solder-ball supplying apparatus

1997-06-23

1999-03-09

Noland, Kenneth

Article dispensing

With discharge assistant

Fluid pressure

221 13, B65G 5900

Patent

active

058789111

ABSTRACT:
A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.

REFERENCES:
patent: 5624054 (1997-04-01), Baws

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