Solder ball printing apparatus

Details Solder ball printing apparatus Solder ball printing apparatus

2010-04-08

2011-10-18

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Preplacing solid filler

C228S248100, C228S180220, C438S612000, C438S613000, C438S614000, C438S615000

Reexamination Certificate

active

08038050

ABSTRACT:
The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

REFERENCES:
patent: 6011629 (2000-01-01), Ootake et al.
patent: 2007/0130764 (2007-06-01), Nebashi et al.
patent: 2010/0072259 (2010-03-01), Honma et al.
patent: 2010/0272884 (2010-10-01), Igarashi et al.
patent: 07202403 (1995-08-01), None
patent: 2005-101502 (2005-04-01), None
patent: 2008-142775 (2008-06-01), None
English computer translation JP 07202403 A.
English Computer Translation JP07202403 date: Aug. 1995.

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