Solder ball printing apparatus

Details Solder ball printing apparatus Solder ball printing apparatus

2011-03-01

2011-03-01

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Preplacing solid filler

C228S248100, C228S180220, C438S612000, C438S613000, C438S614000, C438S615000

Reexamination Certificate

active

07896223

ABSTRACT:
Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy.Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

REFERENCES:
patent: 2007/0130764 (2007-06-01), Nebashi et al.
patent: 2004-062505 (2004-02-01), None
patent: 2005-343593 (2005-12-01), None

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