Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent
1994-07-15
1996-07-30
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
294 641, B23K 306
Patent
active
055403778
ABSTRACT:
A solder ball placement system incorporating a placement head moveable vertically toward and away from a solder ball shuttle having a plurality of solder balls positioned thereon. A corresponding plurality of pickup tubes extend from the placement head and are connected to a vacuum source for attracting and holding a corresponding solder ball. The pickup tubes are mounted for limited vertical movement with respect to the placement head to allow the individual pickup tubes to extend into the placement head varying distances to accommodate for uneven placement of solder balls such as warpage of a workpiece or shuttle. The respective pickup tubes each incorporate a collar abutting against a vibrator plate that is actuated by an ejector solenoid when the vacuum is released and the solder balls are to be placed on a workpiece. A ball sensing system incorporates a diode array having temperature sensitive PN junctions which are subjected to a heat source on one side and the cooling effect of ambient air traveling through pickup tubes on the other side. Sampling of the voltage drop across the respective diodes presents an indication of the presence or absence of solder balls on the respective pickup tubes.
REFERENCES:
patent: 3724687 (1973-04-01), Marschke et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5207467 (1993-05-01), Smith
patent: 5219117 (1993-06-01), Lin
patent: 5414955 (1995-05-01), Morin
LandOfFree
Solder ball placement machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder ball placement machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder ball placement machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1653152