Solder ball placement apparatus

Details Solder ball placement apparatus Solder ball placement apparatus

1998-07-15

2000-05-02

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 41, 228 563, 228 8, 228105, 228245, 228180, 228253, B23K 3512

Patent

active

060561904

ABSTRACT:
An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

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