Solder ball loading method

Details Solder ball loading method Solder ball loading method

2011-08-23

2011-08-23

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C228S180210, C228S180220, C438S612000, C438S613000

Reexamination Certificate

active

08001683

ABSTRACT:
This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

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Supplementary european Search Report, dated May 3, 2010, Application No. 07742024.8. All references marked with an asertisk * were considered by the Examiner on March 16, 2010, and Jun. 28, 2010.

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