Solder ball connection device and capillary tube thereof

Details Solder ball connection device and capillary tube thereof Solder ball connection device and capillary tube thereof

2000-06-19

2002-01-08

Dunn, Tom (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

C228S041000, C228S245000, C228S246000

Reexamination Certificate

active

06336581

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a solder ball connection device for connecting a bonding pad formed at a slider provided with a head, and a lead pad formed at the tip of a lead wire. More particularly, the present invention relates to a tube employed for the solder ball connection apparatus and used to position and hold a solder ball in a solder reflowing process.
DESCRIPTION OF THE RELATED ART
FIG. 8
shows a perspective view of the HG assembly suitable for electrical connection between a lead wire and a slider with use of a solder ball connection method.
FIG. 9
is an expanded view of the tip of the HG assembly. The external shape of the HG assembly
100
is defined by an actuator arm
101
provided with an opening
102
and a load beam
104
extended in the longitudinal direction of the actuator arm
101
from an intermediate portion of its flat portion
103
. The actuator arm
101
and the load beam
104
are bonded together at a portion where they are placed on top of each other.
The opening
102
is used so that the HG assembly
100
is held rotationally by a holder of a magnetic disk apparatus (not shown). The HG assembly
100
, passing through the center of the opening, is rotated in the directions A and B around a virtual axis
150
substantially perpendicular to the flat portion
103
. A mount plate
105
is bonded to the load beam
104
substantially in the center portion so as to be put thereon. A flexure
106
is also disposed on the load beam
104
between the center and the tip thereof. This flexure
106
is bonded to the load beam
104
by a half located at the side of the mount plate
105
. The other half of the flexure
106
located at the side of the tip is not bonded to the load beam
104
.
As shown in
FIG. 9
, at the tip of the flexure
106
is formed an arch-shaped opening
107
and the slider
109
is bonded fixedly to a flexure tang
106
a
(
FIG. 10
) formed so as to be protruded to the center of the arch-shaped opening
107
from a platform
108
formed at the extreme tip of the flexure
106
. This flexure tang
106
a
is supported by a pivot
104
a
(shown with a broken line in
FIG. 10
) protruded from the load beam
104
at one point corresponding to the center of the slider
109
. Consequently, the slider
109
can be inclined at a predetermined angle (often referred to as a pitch, a roll, or a yaw) in every direction with respect to the load beam
104
.
Four leads
110
to
113
are wired partially to an extended portion
105
a
of the mount plate
105
. They are fixed at the extended portion
105
a
with an insulating sheet therebetween respectively so as not to touch each other. At one ends, they compose a multi-connector
114
. The four leads
110
to
113
are connected to the mount plate
105
and the flexure
106
respectively as shown in FIG.
8
and fixed so as not to touch each another with an insulating sheet therebetween respectively. The other ends of the leads are floated in the arch-shaped opening
107
as shown in FIG.
9
and they are paired, crank-bent, and led to the platform
108
.
The paired leads are bent substantially perpendicular to the front surface
109
a
of the slider
109
through two openings
114
and
115
formed between the platform
108
and the flexure tang
106
a
(FIG.
10
). In addition, the lead pads
110
a
to
113
a
are formed corresponding to the connection surfaces of the four bonding pads
116
to
119
formed at this front surface
109
a
. The four leads
110
to
113
are fixed to the platform
108
around their tips with an insulating sheet
20
therebetween respectively. A part of the HG assembly, where the slider
109
does not exist, is equivalent to the slider holder.
The following is a description of a solder ball connection method for connecting the four bonding pads
116
to
119
to the lead pads
110
a
to
113
a
formed so as to be corresponded to those bonding pads
116
to
119
.
FIG. 10
is a sectional view of the major portion of the HG assembly from the direction C at a directing line
151
. The directing line
151
passes the center of the bonding pad
118
shown in FIG.
9
.
FIG. 10
also shows a partial cross sectional view of the solder ball connection device. The load beam
104
is not illustrated here so as to simplify the description, but the position of the pivot
104
a
formed at the load beam
104
is shown with a broken line.
When carrying out a solder ball connection, the inclined HG assembly
100
(
FIG. 8
) is held by a holder (not shown) so that the pad connection surface
118
a
of the bonding pad
118
and the connection surface
112
b
of the lead pad
112
a
face each other substantially perpendicular and each of those connection surfaces
118
a
and
112
b
is inclined substantially at 45° in the direction in which its gravity works.
On the other hand, the capillary tube
121
composes a part of the solder ball connection device (not shown). The capillary tube
121
is disposed in the direction in which the center axis
152
of the cylindrical inner hollow portion
121
a
can use the gravity, that is, at a position where the tip of the capillary tube
121
comes close to both of the bonding pad
118
and the lead pad
112
a
while being inclined at about 45° to the connection surface
112
b
of the lead pad
112
a.
The solder ball connection device (not shown) stores many solder balls
122
and sends one solder ball
122
to the tip of the capillary tube
121
through its inner hollow portion
121
a
after the capillary tube
121
is disposed at a predetermined position. At this time, the apparatus supplies a nitrogen gas (N
2
) in the direction of the arrow a so as to prompt the solder ball
122
to move together with the action of the gravity. In addition, the nitrogen gas also presses the solder ball
122
slightly that is in contact with both connection surfaces
118
a
and
112
b
of the bonding pad
118
and the lead pad
112
a
when the solder ball
122
exists at the tip of the capillary tube
121
.
In this state, the solder ball connection device (not shown) applies a laser beam (shown with a broken line LZ in
FIG. 10
) to the solder ball
122
through the inner hollow portion
121
a
of the capillary tube
121
so as to make the solder ball reflow. The solder ball
122
is then melted in this reflowing, getting both connection surfaces
118
a
and
112
b
of the bonding pad
118
and the lead pad
112
a
wet and connected together. The nitrogen gas supplied at this time presses the melted solder against each connection surface and cover the solder so as to be prevented from oxidation.
This completes the description of the solder ball connection for the bonding pad
118
of the slider
109
and the lead pad
112
a
of the lead
112
. The same procedure can also apply to the connections of other three pads only by changing each position to which the capillary tube
121
is provided.
FIG. 11
is a perspective view of the tip shape of the capillary tube
121
. The conic tip of the capillary tube is cut as shown in
FIG. 11
so that its cross section perpendicular to the center axis
152
is formed like a ring. In this case, as shown in
FIG. 10
, it is difficult to move the tip of the capillary tube
121
down up to the regulation point P
1
orthogonal to the center line
152
through the center of the solder ball
122
, which is in contact with both pads. This is because the tip of the capillary tube
121
comes in contact with any of the pads before reaching the regulation point P
1
, thereby its up and down movement is disturbed by the pad.
If the tip of the capillary tube
121
does not reach the regulation point P
1
as described above, the solder ball
122
can take an idle width at which the solder ball
122
can move in the direction parallel to both connection surfaces
118
a
and
112
b
of the bonding pad
118
and the lead pad
112
, that is, in the direction passing through the paper with FIG.
10
. Consequently, the solder ball
122
comes to reflow the solder ball in an unstable state, thereby the soldering position canno

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