Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-12-02
1998-02-10
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257706, 257738, 257711, 257730, 257780, 257784, 257773, H01L 2334
Patent
active
057172528
ABSTRACT:
A semiconductor device which remains highly reliable and is easy to mount even when a bonding pad pitch is reduced. The semiconductor device is featured in that a thermally conductive support substrate in which a semiconductor chip is fixed to a recessed portion is mounted on the reverse side of an insulating tape, that is, a TAB substrate having a conductor pattern on the surface; and solder balls are placed on the front side of the insulating tape to ensure connection to the conductor pattern on the front side through holes.
REFERENCES:
patent: 4278990 (1981-07-01), Fichot
patent: 5045921 (1991-09-01), Lin et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5394009 (1995-02-01), Loo
patent: 5409865 (1995-04-01), Karnezos
patent: 5561323 (1996-10-01), Andros et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5598321 (1997-01-01), Mosnafazadett et al.
Fukui Atsushi
Nakashima Takashi
Takai Keiji
Tateishi Koji
Hardy David B.
Mitsui High-Tec, Inc.
Thomas Tom
LandOfFree
Solder-ball connected semiconductor device with a recessed chip does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder-ball connected semiconductor device with a recessed chip , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder-ball connected semiconductor device with a recessed chip will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2079370