Solder ball bonding method and bonding device

Electric heating – Metal heating – By arc

Reexamination Certificate

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Details

C219S085120, C219S085130, C219S121630

Reexamination Certificate

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10936747

ABSTRACT:
Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

REFERENCES:
patent: 3549733 (1970-12-01), Caddell
patent: 6059176 (2000-05-01), Azdasht et al.
patent: 6336581 (2002-01-01), Tuchiya et al.
patent: 6543677 (2003-04-01), Pattanaik et al.
patent: 6742694 (2004-06-01), Satoh et al.
patent: 72609 (1983-02-01), None
patent: 8-236916 (1996-09-01), None
patent: 11-509375 (1999-08-01), None
patent: 2002-25025 (2002-01-01), None
Patent Abstracts of WIPO, WO 97/20654, Jun. 12, 1997.

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