Solder ball attachment system

Details Solder ball attachment system Solder ball attachment system

2005-06-14

2005-06-14

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S047100, C228S049200, C228S245000, C228S246000

Reexamination Certificate

active

06905059

ABSTRACT:
A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.

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