Solder ball assembly, a method for its manufacture, and a...

Details Solder ball assembly, a method for its manufacture, and a... Solder ball assembly, a method for its manufacture, and a...

2005-07-19

2005-07-19

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S780000

Reexamination Certificate

active

06919634

ABSTRACT:
A solder ball assembly includes a mask having first and second sides and a plurality of holes formed therein. Each hole has a first end opening onto the first side of the mask and a second end. A plurality of solder balls are disposed in the holes, and a fixing agent secures the solder balls in the holes. A protective sheet may be attached to one or both sides of the mask to cover the ends of the holes.

REFERENCES:
patent: 6084781 (2000-07-01), Klein
patent: 6087597 (2000-07-01), Shimada et al.
patent: 6201707 (2001-03-01), Sota
patent: 6460755 (2002-10-01), Inoue et al.
patent: 6596620 (2003-07-01), Cheng et al.
patent: 08115916 (1996-05-01), None
patent: 08309523 (1996-11-01), None
patent: 10275974 (1998-10-01), None
patent: 2001-196730 (2001-07-01), None

Affiliated with

Also associated with

Rating

Solder ball assembly, a method for its manufacture, and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder ball assembly, a method for its manufacture, and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder ball assembly, a method for its manufacture, and a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3403951