Solder attached contact and a method of manufacturing the same

Details Solder attached contact and a method of manufacturing the same Solder attached contact and a method of manufacturing the same

2011-03-22

2011-03-22

Abrams, Neil (Department: 2839)

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

C228S180210, C228S255000

Reexamination Certificate

active

07909666

ABSTRACT:
There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.

REFERENCES:
patent: 3780433 (1973-12-01), Lynch
patent: 3997237 (1976-12-01), White
patent: 4274699 (1981-06-01), Keim
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4661887 (1987-04-01), Lin
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 6227877 (2001-05-01), Mou et al.
patent: 6636063 (2003-10-01), Arnold et al.
patent: 6717421 (2004-04-01), Kazama
patent: 7377788 (2008-05-01), Hasegawa
patent: 7695329 (2010-04-01), Peloza et al.
patent: 2001/0054906 (2001-12-01), Fujimura
patent: 2002/0017915 (2002-02-01), Kamiya
patent: 2002/0060580 (2002-05-01), Yamabe
patent: 2002/0061668 (2002-05-01), Fujimura
patent: 2002/0146920 (2002-10-01), Sugiyama
patent: 2001-330627 (2001-11-01), None
patent: 2002-5960 (2002-01-01), None
patent: 2002-31652 (2002-01-01), None
patent: 2002-158264 (2002-05-01), None
patent: 2002-164104 (2002-06-01), None
patent: 2002-283049 (2002-10-01), None
patent: 2005-201844 (2005-07-01), None
patent: 2005-203606 (2005-07-01), None
patent: WO01/018553 (2001-03-01), None

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