Solder attach film and assembly

Details Solder attach film and assembly Solder attach film and assembly

2010-04-02

2010-12-28

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257SE21508, C257SE23021, C257SE23069, C438S613000

Reexamination Certificate

active

07859107

ABSTRACT:
A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.

REFERENCES:
patent: 6249963 (2001-06-01), Chou et al.
patent: 6930031 (2005-08-01), Huang
patent: 2007/0145548 (2007-06-01), Park et al.

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