Solder assembly of components

Details Solder assembly of components Solder assembly of components

1989-06-27

1991-05-07

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361398, 361403, 361406, 361414, H05K 111

Patent

active

050141627

ABSTRACT:
Disclosed is an apparatus involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.

REFERENCES:
patent: 3676746 (1972-07-01), Kassabgi
patent: 3953664 (1976-04-01), Tsunashima
patent: 4064357 (1977-12-01), Dixon et al.
patent: 4437141 (1984-03-01), Prokop
patent: 4806107 (1989-02-01), Arnold et al.

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