Solder applying mechanism

Details Solder applying mechanism Solder applying mechanism

1990-06-11

1991-09-03

Hoag, Willard

Coating apparatus

Solid member or material acting on coating after application

Reciprocating member

101123, 101126, 118301, 118306, 427 96, B05C 102

Patent

active

050443062

ABSTRACT:
Mechanism is disclosed for wiping solder paste onto a printed circuit board through a stencil superposed on the board, including a first squeeges for wiping solder paste onto the stencil, a second squeegee for depositing solder paste at a location for engagement by the first squeeges and a tray, alternatively engagable with both squeeges to cooperate with the squeeges to deposit solder paste at the beginning of a wiping stroke and to pick up excess solder paste at the end of a wiping stroke.

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patent: 4121519 (1978-10-01), Porth
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patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4678531 (1987-07-01), Metzger et al.
patent: 4693209 (1987-09-01), Leicht
patent: 4747211 (1988-05-01), Gilleo et al.
patent: 4776271 (1988-10-01), Schlipf et al.
patent: 4919970 (1990-04-01), Hoebener et al.

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