Solder application to a circuit board

Details Solder application to a circuit board Solder application to a circuit board

1993-03-02

1996-05-28

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Sonic or ultrasonic

427 96, 427436, B06B 120

Patent

active

055209670

ABSTRACT:
Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

REFERENCES:
patent: 3859722 (1975-01-01), Kinsky et al.
patent: 3945618 (1976-03-01), Shoh
patent: 4592944 (1986-06-01), Clark et al.
patent: 4637541 (1987-01-01), Tanny
IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976, pp. 3182-3183.
IBM Technical Disclosure Bulletin, vol. 24, No. 11A Apr. 1982, p. 5726.
IBM Technical Disclosure Bulletin, vol. 27, No. 1A, Jun. 1984, "Vibration Soldering Equipment", by J. L. Backes et al., pp. 71-72.
3114665 (Japan) May 15, 1991 Abstract.
2050492 Feb. 20, 1990 (Japan) Abstract.

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