Solder application to a circuit board

Details Solder application to a circuit board Solder application to a circuit board

1995-06-05

1997-06-10

Thomas, Laura

Animal husbandry

Aquatic animal culturing

Aquarium

2281801, 361767, H05K 100

Patent

active

056378335

ABSTRACT:
Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5386087 (1995-01-01), Lee et al.
patent: 5400948 (1995-03-01), Sajja et al.
patent: 5478973 (1995-12-01), Yoon et al.

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