Solder application technique

Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S124500, C228S190000, C228S223000, C228S260000, C228S261000

Reexamination Certificate

active

06840432

ABSTRACT:
A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

REFERENCES:
patent: 2586285 (1952-02-01), Ackermann
patent: 2593955 (1952-04-01), Ackermann
patent: 3328631 (1967-06-01), Greber
patent: 3903494 (1975-09-01), May
patent: 3979043 (1976-09-01), Lowery
patent: 4100588 (1978-07-01), Kresge
patent: 4286743 (1981-09-01), Vasseur et al.
patent: 4296002 (1981-10-01), Sokoly et al.
patent: 4316171 (1982-02-01), Miyabayshi et al.
patent: 4352140 (1982-09-01), Axelsson et al.
patent: 4423404 (1983-12-01), Goedde et al.
patent: 4427843 (1984-01-01), Ishihara et al.
patent: 4444351 (1984-04-01), Dries et al.
patent: 4448806 (1984-05-01), Levinson
patent: 4476513 (1984-10-01), Stenström
patent: 4538347 (1985-09-01), Palilla et al.
patent: 4656555 (1987-04-01), Raudabaugh
patent: 4729053 (1988-03-01), Maier et al.
patent: 4816959 (1989-03-01), Maier et al.
patent: 4825188 (1989-04-01), Parraud et al.
patent: 4833438 (1989-05-01), Parraud et al.
patent: 4851955 (1989-07-01), Doone et al.
patent: 4930039 (1990-05-01), Woodworth et al.
patent: 4992906 (1991-02-01), Doone et al.
patent: 5003689 (1991-04-01), Doone et al.
patent: 5113306 (1992-05-01), Veverka et al.
patent: 5138517 (1992-08-01), Raudabaugh
patent: 5159158 (1992-10-01), Sakich et al.
patent: 5159748 (1992-11-01), Doone et al.
patent: 5210676 (1993-05-01), Mashikian
patent: 5214249 (1993-05-01), Goch et al.
patent: 5218508 (1993-06-01), Doone
patent: 5268045 (1993-12-01), Clare
patent: 5291366 (1994-03-01), Giese et al.
patent: 5322205 (1994-06-01), Kato et al.
patent: 5336852 (1994-08-01), Goch et al.
patent: 5340015 (1994-08-01), Hira et al.
patent: 5363266 (1994-11-01), Wiseman et al.
patent: 5497138 (1996-03-01), Malpiece et al.
patent: 5500996 (1996-03-01), Fritsch et al.
patent: 5526977 (1996-06-01), Wei
patent: 5594613 (1997-01-01), Woodworth et al.
patent: 5602710 (1997-02-01), Schmidt et al.
patent: 5608597 (1997-03-01), Holmström et al.
patent: 5625523 (1997-04-01), Nedriga
patent: 5652690 (1997-07-01), Mansfield et al.
patent: 5680289 (1997-10-01), Robinson et al.
patent: 5695841 (1997-12-01), Mazeika et al.
patent: 5708555 (1998-01-01), Woodworth et al.
patent: 5712757 (1998-01-01), Bennett et al.
patent: 5724221 (1998-03-01), Law
patent: 5757604 (1998-05-01), Bennett et al.
patent: 5818677 (1998-10-01), Bennett et al.
patent: 5830405 (1998-11-01), Mazeika et al.
patent: 5894053 (1999-04-01), Fried
patent: 5896266 (1999-04-01), Rubinski
patent: 5912611 (1999-06-01), Berggren et al.
patent: 5930102 (1999-07-01), Rook
patent: 5936824 (1999-08-01), Carpenter, Jr.
patent: 5936825 (1999-08-01), DuPont
patent: 5936826 (1999-08-01), Schmidt
patent: 5959822 (1999-09-01), Bock et al.
patent: 5964395 (1999-10-01), Glovatsky et al.
patent: 6008975 (1999-12-01), Kester et al.
patent: 6008977 (1999-12-01), Thatcher
patent: 6238199 (2001-05-01), Schallenmueller et al.
patent: 6396676 (2002-05-01), Doone et al.
patent: 6519129 (2003-02-01), Ramarge et al.
patent: 33 34 533 (1985-04-01), None
patent: 2 048 116 (1980-12-01), None
patent: WO 9732382 (1997-09-01), None
patent: WO 9918642 (1999-04-01), None
patent: WO 9937434 (1999-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solder application technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder application technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder application technique will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3418720

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.