Solder application system using helix to control solder meniscus

Electric heating – Heating devices – Tool or instrument

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Details

219229, 228 52, 239602, 222593, 222527, H05B 342

Patent

active

054462614

ABSTRACT:
A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

REFERENCES:
patent: 2380138 (1945-07-01), Abramson
patent: 3121156 (1964-02-01), Kamborian
patent: 4934309 (1990-06-01), Ledermann et al.

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