Metal fusion bonding – Process – Plural joints
Patent
1992-03-17
1992-10-20
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228260, 228 37, B23K 100, B23K 300
Patent
active
051563240
ABSTRACT:
Two opposing hollow non-turbulent solder waves are provided which project inwards and solder is collected in a containment area. The two solder waves can have different flows and pressures, the first solder wave flooding the underside of a circuit board or other item and the second solder wave reducing a build up of solder. The soldering apparatus has a solder tank with a conveyor to convey items to a first solder wave and to a second solder wave. A solder containment area is provided between the two solder waves which receives solder from the solder waves and feeds the solder back into the solder tank.
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Kirsten Publication entitled "Hollow Wave Jet" believed to have been published in 1988.
Dee Dual Wave Soldering Machine, Dee Electric Company Brochure, published Sep. 1962.
Hueste Greg L.
Ring Francis L.
Electrovert LGD
Heinrich Samuel M.
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