Solder apparatus and method

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler

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Details

228 52, 432221, 432231, 392379, 392480, B23K 300

Patent

active

057588155

ABSTRACT:
A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).

REFERENCES:
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patent: 3754698 (1973-08-01), Bochinski et al.
patent: 4161647 (1979-07-01), Carbonnel
patent: 4295596 (1981-10-01), Doten et al.
patent: 4686354 (1987-08-01), Makin
patent: 4847465 (1989-07-01), Toyama et al.
patent: 5447577 (1995-09-01), Gao et al.

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