Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent
1997-01-07
1998-06-02
Heinrich, Samuel M.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
228 52, 432221, 432231, 392379, 392480, B23K 300
Patent
active
057588155
ABSTRACT:
A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).
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French William
Lees Stuart
McCall Colin David
Murray Kenneth Skene
Robertson Brian
Fraley Lawrence R.
Heinrich Samuel M.
International Business Machines - Corporation
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