Solder and tin stripper compositions

Details Solder and tin stripper compositions Solder and tin stripper compositions

1991-04-25

1993-06-15

Dang, Thi

Compositions

Etching or brightening compositions

Inorganic acid containing

252 794, 156656, 156664, 134 3, 134 41, C23D 100

Patent

active

052194841

ABSTRACT:
An improved method for rapidly stripping solder or tin from a substrate, such as copper, without adversely affecting the substrate. This is especially useful in the preparation of printed circuit boards. The composition comprises an acidic solution of an iron salt, a nitrate, at least one complexing agent such as gluconate, citrate, or EDTA, and at least one acid source. The acid source can comprise any mixture of compatible mineral and organic acids in any combination. The organic acids can include soluble aliphatic, substituted aliphatic, aromatic, or mixed acids. The mixture should be substantially free of halides and sulfates. This highly stable, rapid stripping rate formulation gives no attack on exposed glass fibers or epoxy printed circuit laminate material. It can operate over a wide temperature range without needing close temperature control.

REFERENCES:
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patent: 3990982 (1976-11-01), Dixon
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patent: 4439338 (1984-03-01), Tomaiuolo
patent: 4713144 (1987-12-01), Schiller
patent: 4851148 (1989-07-01), Yamasoe et al.
patent: 4921571 (1990-05-01), Kukanski et al.
patent: 4964920 (1990-10-01), Jackson et al.
patent: 4980076 (1990-12-01), Tanaka et al.
patent: 5017267 (1991-05-01), Cordani

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