Solder and soldering method

Details Solder and soldering method Solder and soldering method

1996-09-18

1999-02-16

Ryan, Patrick

Metal treatment

Compositions

Fluxing

2281801, 228242, 228243, H05K 332

Patent

active

058715924

ABSTRACT:
Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer. The soldering paste obtained by mixing this photosetting flux is printed and bonded on the surface of soldered portion of a printed substrate, and is brought into tight contact with the pad portion of a lead of an electronic part to be soldered. The surface of soldering paste exposed is irradiated with ultraviolet light to cause the surface to gel. Thereafter, soldering is effected by means of preliminary heating and solder melting and heating(reflow heating). Since the surface of the soldering paste is thereby hardened by the irradiation of ultraviolet light, no sags occur during preliminary heating, thus making it possible to prevent any defective bridge caused by sags.

REFERENCES:
patent: 5137936 (1992-08-01), Akiguchi et al.

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