Solder, and mounted components using the same

Details Solder, and mounted components using the same Solder, and mounted components using the same

2005-04-21

2010-11-09

Zimmerman, John J (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C420S560000, C420S562000

Reexamination Certificate

active

07829199

ABSTRACT:
An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.

REFERENCES:
patent: 6109506 (2000-08-01), Blair et al.
patent: 6241942 (2001-06-01), Murata et al.
patent: 2004/0262779 (2004-12-01), Amagai et al.
patent: 2006/0011702 (2006-01-01), Funaya et al.
patent: 2006/0261131 (2006-11-01), Hirata et al.
patent: 1421296 (2003-06-01), None
patent: 59-189096 (1984-10-01), None
patent: 05-050286 (1993-03-01), None
patent: 09-094687 (1997-04-01), None
patent: 11-129091 (1999-05-01), None
patent: 11-320177 (1999-11-01), None
patent: 2000-015478 (2000-01-01), None
patent: 2001-168513 (2001-06-01), None
patent: 2001-203444 (2001-07-01), None
patent: 2001-347394 (2001-12-01), None
patent: 2002-195433 (2002-07-01), None
patent: 2002-283093 (2002-10-01), None
patent: 3357045 (2002-10-01), None
patent: 2004-034099 (2004-02-01), None
Machine translation of JP 11-129091. Sep. 27, 2009.
Machine translation of JP 2001-347394. Sep. 29, 2009.
Machine translation of JP 2004-034099. Sep. 29, 2009.

Affiliated with

Also associated with

Rating

Solder, and mounted components using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder, and mounted components using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder, and mounted components using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4170886