Solder alloys for soldering difficultly solderable material

Specialized metallurgical processes – compositions for use therei – Processes – Free metal or alloy reductant contains magnesium

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75151, 75166C, 75175A, B23K 3512

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041069307

ABSTRACT:
Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180.degree. C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60% Cd and 0.05 - 10% by wt Zn with the simultaneous application of vibration, preferably ultrasonic vibration.

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patent: 2515022 (1950-07-01), Snyder et al.
patent: 3744121 (1973-07-01), Nagano et al.
patent: 3949118 (1976-04-01), Nagano et al.

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