Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2006-06-13
2006-06-13
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C148S023000, C228S261000, C438S613000
Reexamination Certificate
active
07059512
ABSTRACT:
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method).
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Arita Hitoshi
Kojima Akio
Cooper & Dunham LLP
Johnson Jonathan
Ricoh & Company, Ltd.
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