Solder alloy for the direct soldering of oxide containing silver

Details Solder alloy for the direct soldering of oxide containing silver Solder alloy for the direct soldering of oxide containing silver

1980-12-01

1982-08-17

Rutledge, L. Dewayne

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75134C, C22C 508

Patent

active

043447945

ABSTRACT:
For soldering non-noble metal containing silver contacts on contact carriers, solders are needed which permit a direct soldering without production of an oxide free intermediae layer. This is attained with solders that consist of a silver-copper alloy with cadmium and/or tin and/or indium whereby the composition must be so selected that the liquidus temperature does not exceed 750.degree. C.

REFERENCES:
patent: 2151905 (1939-03-01), Emmert
patent: 2196302 (1940-04-01), Hensel et al.
patent: 2914435 (1959-11-01), Wasserman et al.
patent: 2970248 (1961-01-01), Sahagun
patent: 4164419 (1979-08-01), Kaji et al.
Johnson et al., Splat Cooled Alloys in the Ag-Sn-Cu System; pert pgs-pgs-p. 5 (Table 1); Mar. 1973.

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