Solder alloy for bonding oxide material, and solder joint...

Details Solder alloy for bonding oxide material, and solder joint... Solder alloy for bonding oxide material, and solder joint...

2008-10-02

2010-06-29

Ip, Sikyin (Department: 1793)

Metal treatment

Stock

Containing over 50 per cent metal, but no base metal

C148S400000, C420S562000, C420S577000, C420S589000

Reexamination Certificate

active

07744706

ABSTRACT:
The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.

REFERENCES:
patent: 5833921 (1998-11-01), Paruchuri et al.
patent: 2000-141078 (2000-05-01), None
patent: 2002-20143 (2002-01-01), None
patent: 2002-542138 (2002-12-01), None
patent: 2005081404 (2005-03-01), None
patent: 2006-159278 (2006-06-01), None

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