Solder alloy and soldered bond

Metal treatment – Stock

Reexamination Certificate

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C420S557000

Reexamination Certificate

active

06893512

ABSTRACT:
A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

REFERENCES:
patent: 0 976 489 (2000-02-01), None
patent: 8-19892 (1996-01-01), None
patent: 9-174278 (1997-07-01), None
patent: 2000-15478 (2000-01-01), None
patent: 2000015478 (2000-01-01), None
patent: 2000141078 (2000-05-01), None
patent: 2001-347394 (2001-12-01), None
patent: 2002-1575 (2002-01-01), None

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