Solder alloy and glass bonded body using the same

Details Solder alloy and glass bonded body using the same Solder alloy and glass bonded body using the same

2011-03-08

2011-03-08

Xu, Ling (Department: 1784)

Stock material or miscellaneous articles

Composite

Of quartz or glass

C420S557000, C428S426000, C428S432000, C428S457000

Reexamination Certificate

active

07901782

ABSTRACT:
The invention provides a solder alloy containing, by mass, 2.0 to 15.0% of Ag, 0.1 to 6.0% of Al, 0.01 to 0.50% of Y, the balance being Sn and unavoidable impurities. The solder alloy preferably contains 0.01 to 0.50% of Ge by mass. The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass. The invention provides a glass bonded body formed by bonding glasses with the use of the solder alloy.

REFERENCES:
patent: 6319617 (2001-11-01), Jin et al.
patent: 2009/0208363 (2009-08-01), Yamada et al.
patent: 1245328 (2002-10-01), None
patent: 59-128279 (1984-07-01), None
patent: 11129091 (1999-05-01), None
patent: 2000141078 (2000-05-01), None
patent: 2003211283 (2003-07-01), None
patent: 2006319215 (2006-11-01), None
patent: 2007007840 (2007-01-01), None
Translation of JP-59-128279.
Chinese Office Action dated Jul. 29, 2010.

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