Solder

Details Solder Solder

1994-11-04

1997-11-25

Ip, Sikyin

Alloys or metallic compositions

Tin base

Lead containing

420563, 420566, 420571, B23K 3536

Patent

active

056908903

ABSTRACT:
A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

REFERENCES:
Abstract of JP-3255637, Toshiba, "Solder for Die Bonding of Substrate and Semiconductor . . . ", Nov. 14, 1991.
Abstract of JP-57072789, Shigemi, "Solder Alloy", Jul. 5, 1982.
Abstract of JP-55018505, Narutoshi et al., "Soldering Alloy for Attaching Silver Electrode Leading Wire", Oct. 4, 1980.

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