SOI component comprising margins for separation

Details SOI component comprising margins for separation SOI component comprising margins for separation

2008-07-15

2008-07-15

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S847000

Reexamination Certificate

active

10527183

ABSTRACT:
A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or compression, as well as electrical structures which are in connection therewith. To this end, a sacrificial layer is produced on or within a substrate and an activatable layer on top of the sacrificial layer, the sensitive region and at least a portion of the electrical structures being positioned on top or within an activatable layer, and a circumferential trench is produced around the region of the sensor element to be produced and having the sensitive region and the portion of the electrical structures, the trench being interrupted by at least one connecting point, which connects the region of the sensor element to the portion of the activatable layer lying outside the circumferential trench. This is followed by a removal of the sacrificial layer underneath the region of the sensor element, a fixation of the region of the sensor element with the aid of a holding device, rupturing of the connecting points and a transfer of the sensor element, fixated by the holding device, and connecting a carrier to the component as well as joining with a carrier to the component.

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