Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer
Reexamination Certificate
2007-10-30
2007-10-30
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
On insulating substrate or layer
C438S474000, C438S513000, C257SE21170, C257SE21127, C257SE21218, C257SE21248, C257SE21304, C257SE21320
Reexamination Certificate
active
11302770
ABSTRACT:
A wafer having an SOI configuration and active regions having different surface orientations for different channel type transistors. In one example, semiconductor structures having a first surface orientation are formed on a donor wafer. Semiconductor structures having a second surface orientation are formed on a second wafer. Receptor openings are formed on the second wafer. The semiconductor structures having the first surface orientation are located in the receptor openings and transferred to the second wafer. The resultant wafer has semiconductor regions having a first surface orientation for a first channel type of transistor and semiconductor regions having a second surface orientation for a second channel type transistor.
REFERENCES:
patent: 5384473 (1995-01-01), Yoshikawa et al.
patent: 6616854 (2003-09-01), Jones et al.
patent: 6635543 (2003-10-01), Furukawa et al.
patent: 7125785 (2006-10-01), Cohen et al.
patent: 2005/0070077 (2005-03-01), Guarini et al.
patent: 2006/0049460 (2006-03-01), Chen et al.
patent: 2006/0105536 (2006-05-01), Cheng et al.
M. Yang, et al., High Performance CMOS Fabricated on Hybrid Substrate With Different Crystal Orientations, 0-7803-7873-3/03, 2003 IEEE.
B. Doris, et al., A Simplified Hybrid Orientation Technology (SHOT) for High Performance CMOS, date unknown.
His-Jen J. Yeh, et al., Fluidic Self-Assembly for the Integration of GaAs Light-Emitting Diodes on Si Substrates, 1041-1135/94, 1994 IEEE.
Jennifer Ouellette, Exploiting Molecular Self-Assembly, Dec. 2000, American Institute of Physics pp. 26-29.
Olubunmi O. Adetutu, et al., Modified Dual Substrate Orientation, Filing Date—Apr. 27, 2005, U.S. Appl. No. 11/209,869.
Adetutu Olubunmi O.
Jones Robert E.
White Ted R.
Clingan, Jr. James L.
Dolezal David G.
Freescale Semiconductor Inc.
Nhu David
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