Electrical computers and digital processing systems: interprogra – High level application control
Reexamination Certificate
2003-09-30
2008-08-05
Thomson, William (Department: 2194)
Electrical computers and digital processing systems: interprogra
High level application control
C717S106000
Reexamination Certificate
active
07409692
ABSTRACT:
Methods and apparatus, including computer program products, implement techniques for structuring applications into reusable components. A reusable software component is implemented. The component encapsulates functionality, where multiple instances of the component are usable at the same time. The component has at least one visual representation. The component has a programming interface for programmatic interaction with the component, a data-binding interface for data communication with the component, and a visual interface to access the at least one visual representation of the component.
REFERENCES:
patent: 5426747 (1995-06-01), Weinreb et al.
patent: 6230309 (2001-05-01), Turner et al.
patent: 6748455 (2004-06-01), Hinson et al.
patent: 7117480 (2006-10-01), Andersh et al.
patent: 2003/0046395 (2003-03-01), Fleming et al.
Template Software, Inc., Using the SNAP Language (LANG), Chapters 1 and 3, copyright 1998, released 1997, pp. 1-5 and 3-4.
Template Software, Inc., Using the SNAP Communication Component (COM), Chapter 5, copyright 1998, released 1997, pp. 5-2,5-9, and 5-10.
Template Software, Inc., Getting Started with SNAP (START), Chapters 1 and 5, copyright 1998, released 1997, pp. 1-5, 5-3 and 5-17.
Template Software, Inc., Using the SNAP External Application Software Component (EXT), Chapters 2 and 3, copyright 1998, released 1997, pp. 2-2, 3-2, and 3-3.
Template Software, Inc., Using the SNAP Development Environment (SNAPDEV), Chapters 1,3, 4, and 5 copyright 1998, released 1997, pp. 1-5, 3-2, 4-2, 4-5, 4-6, and 5-3.
Cherdron Markus
Goerke Bjoern
Ittel Jens
Fountainhead Law Group P.C.
SAP (AG)
Thomson William
Verdi KimbleAnn
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