Softener-free polyamide and molding composition and use thereof

Details Softener-free polyamide and molding composition and use thereof Softener-free polyamide and molding composition and use thereof

1999-05-06

2000-08-08

Hampton-Hightower, P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528125, 528128, 528170, 528272, 528274, 528288, 528292, 528322, 528332, 528335, 528336, C08G 6940, C08G 7300, C08G 6944

Patent

active

061003700

ABSTRACT:
The invention concerns a softener-free polyamide prepared by polycondensation and/or polymerization of polyamide-forming monomers, wherein it was obtained by adding 5-50 wt. % of a dimer diol with a molecular weight within the range of 400-1000 and/or corresponding OH-terminated polyesters.

REFERENCES:
patent: 5574128 (1996-11-01), Judas et al.

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