Soft-solder alloy for bonding ceramic articles

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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228121, 228122, 22826312, 420557, 420563, 420566, 428457, 428645, 428646, B32B 1501, B32B 1504, C22C 1100, C22C 1300

Patent

active

047973285

ABSTRACT:
Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.

REFERENCES:
patent: 2805944 (1957-09-01), Bender
patent: 3484210 (1969-12-01), Pinter

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