Soft magnetic powder material containing a powdered...

Details Soft magnetic powder material containing a powdered... Soft magnetic powder material containing a powdered...

2008-05-20

2008-05-20

Le, H. T (Department: 1794)

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

C428S407000, C428S689000, C428S699000, C428S704000

Reexamination Certificate

active

11073735

ABSTRACT:
A soft magnetic powder material includes an iron powder, and a plated layer formed on a surface of the iron powder and possessing a lubricating property. The plated layer includes a lubricant material and a matrix in which the lubricant material disperses. The soft magnetic powder material is manufactured by an electroless deposition process, by which a plated layer is formed by depositing, on a surface of an iron powder, at least one element building a matrix, along with a micro-powdered lubricant material.

REFERENCES:
patent: 4833040 (1989-05-01), Fishman et al.
patent: 5607768 (1997-03-01), Lee
patent: 5963771 (1999-10-01), Chan et al.
patent: 6723179 (2004-04-01), Yagi et al.
patent: 7033413 (2006-04-01), Iyoda et al.
patent: 2002-280209 (2002-09-01), None
patent: 2002-329626 (2002-11-01), None
patent: 2003-183702 (2003-07-01), None
patent: WO 98/38655 (1998-09-01), None
Ichiro Takasu, et al, “Improvement of the sintering process in a Sendust alloy powder used as a magnetic recording head material.” Journal of Magnetism and Magnetic Materials, XP-004065753, vol. 163, No. 3, Nov. 1996, pp. 397-400.

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