Soft impact dispense nozzle

Coating apparatus – Projection or spray type – Rotating turret work support

Patent

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Details

118 52, 118300, 239518, B05B 1302, B05B 126

Patent

active

059548770

ABSTRACT:
An apparatus and a method of dispensing process liquid from a liquid source onto a surface of a semiconductor wafer is disclosed in accordance with the present invention. The apparatus includes a nozzle having a bore with a longitudinal axis in fluid communication with the liquid source and a flow surface having a perimeter. The flow surface is oriented at a first angle relative to the axis and in fluid communication with the bore to dispense a sheet of process liquid from the perimeter onto a wafer surface. In a preferred embodiment, the nozzle is axisymmetric and includes a housing having a source portion connected to the liquid source and a dispense portion, and the bore traverses the source and dispense portions. An insert is provided having a first section disposed in the dispense portion of the bore adjacent to the source portion and a second section including the flow surface which is fully circumferential and continuous. The flow surface is in close proximity to the dispense portion, so as to define a flow path along the flow surface to control the flow of the process liquid. In the method of the invention, the nozzle is positioned to dispense a sheet of process liquid onto the wafer surface, while the surface is being rotated. The nozzle is radially offset from the center of the surface such that a portion of the continuous sheet of process liquid is dispensed directly onto the center of the wafer surface.

REFERENCES:
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patent: 3811621 (1974-05-01), Augustine
patent: 3825188 (1974-07-01), Doering
patent: 3831861 (1974-08-01), Hanson, Jr.
patent: 4932591 (1990-06-01), Cruz
patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5020200 (1991-06-01), Mimasaka et al.
patent: 5405813 (1995-04-01), Rodrigues
patent: 5429912 (1995-07-01), Neoh

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