Socket with improved base

Details Socket with improved base Socket with improved base

2001-12-07

2002-06-18

Ta, Tho D. (Department: 2833)

Electrical connectors

With coupling movement-actuating means or retaining means in...

Including compound movement of coupling part

C439S259000

Reexamination Certificate

active

06406318

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a socket connector mounted on a mother board, and particularly to a ball grid array (BGA) socket with an improved base to reduce the height of a space formed between the socket and the mother board due to thermal stress during soldering process.
2. Description of Related Art
BGA sockets are widely used in computer industry for electrically connecting a central processing unit (CPU) to a mother board. A conventional BGA socket
9
mounted on a mother board
8
is disclosed in
FIGS. 5-7
. The BGA socket
9
generally comprises an insulative base
91
, an array of conductive contacts
952
retained in the base
91
, and a cover
92
movably mounted on the base
91
. A corresponding number of solder balls
954
are attached to lower ends of the conductive contacts
952
for soldering onto the underlying mother board
8
by infrared (IR) generally. The base
91
may be warped due to thermal stress, and a space
93
is formed between a bottom surface
94
of the base
91
and the mother board
8
. If the height of the space
93
is beyond allowable tolerance, the solder ball
954
could not be soldered with the mother board
8
.
Hence, a BGA socket having an improved base is required to overcome the disadvantages of the conventional socket.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention is to provide a BGA socket having an improved base to reduce the height of a space formed between the socket and a mother board due to thermal stress during first and second IR soldering processes.
In order to achieve the object set forth, a BGA socket of the present inventing comprises a base, an array of conductive contacts retained in the base, a sliding cover and an actuating lever. The base includes a rectangular body and a mounting portion at a rear end thereof. The body comprises a plurality of through hole for receiving the contacts, and the mounting portion has a first surface and a second surface at the bottom. The first surface and the second surface define a vertical offset therebetween for compensating for a space between the first surface and the mother board caused by thermal stress during soldering.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5722848 (1998-03-01), Lai et al.
patent: 5833483 (1998-11-01), Lai et al.
patent: 6042413 (2000-03-01), Hsiao et al
patent: 6065990 (2000-05-01), McHugh et al.
patent: 6113411 (2000-09-01), Lu et al.
patent: 6152757 (2000-11-01), Szu
patent: 6186816 (2001-02-01), Lu et al.
patent: 6210196 (2001-04-01), Wang et al.
patent: 6231367 (2001-05-01), Hsiao et al.
patent: 6243267 (2001-06-01), Chuang
patent: 6264490 (2001-07-01), Lemke et al.

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