Socket terminal positioning method and construction

Special receptacle or package – For a building component – Shingle

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Details

206347, 206443, 206328, B65D 7302, B65D 8524

Patent

active

044429380

ABSTRACT:
An improved method and construction for positioning a plurality of socket terminals on an electrical circuit board in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material is provided with a plurality of holes in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head including an intermediate groove such that the heads extend into the holes and are adapted for frictional snap engagement with the sheet. The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the board. Thereafter, the sheet may be removed. The enlarged head of the circuit terminal is provided with leading edge sheet contacting surface to enable the terminals to be push positioned into the holes without injuring the sheet.

REFERENCES:
patent: 3097360 (1963-07-01), Carlson, Jr. et al.
patent: 3545606 (1970-12-01), Bennett et al.
patent: 3892313 (1975-07-01), Lange
patent: 4099615 (1978-07-01), Lemke et al.

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