Socket including centrally distributed test tips for testing unp

Details Socket including centrally distributed test tips for testing unp Socket including centrally distributed test tips for testing unp

1995-05-23

1999-12-14

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, 324755, G01R 3102, G01R 3126

Patent

active

060022663

ABSTRACT:
A singulated die test socket is presented. The socket allows for die to be fully functional tested and thermal tested before packaging. The socket is created from similar silicon material as the die being tested thereby producing a match of thermal coefficients of expansion between the socket and the die. It is also possible to provide additional circuitry in the socket to aid in the testing of the die. The test socket may also be used as an integrated circuit package by adding a lid, used to seal the die within the package cavity. In both uses the socket cavity may be created with sloping sidewalls, the sloping sidewalls providing for self alignment of the die within socket cavity.

REFERENCES:
patent: 4766371 (1988-08-01), Moriya
patent: 5172050 (1992-12-01), Swapp
patent: 5177439 (1993-01-01), Liu et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5323035 (1994-06-01), Leedy
patent: 5402077 (1995-03-01), Agahdel et al.
patent: 5414370 (1995-05-01), Hashinaga et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5530376 (1996-06-01), Lim et al.

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